Chemical-mechanical polishing

Kimyoviy-mexanik silliqlash (chemical mechanical polishing, CMP) — sirtlarni kimyoviy va mexanik kuchlar birgalikda taʼsir ettirib tekislash jarayoni.

Havolalar

• «CMP, chemical mechanical planarization, polishing equipment», muallif: Crystec Technology Trading GmbH, manba: http://www.crystec.com/alpovere.htm
• «Chemical Mechanical Planarization», mualliflar: Dr. Wang Zengfeng, Dr. Yin Ling, Ng Sum Huan va Teo Phaik Luan, manba: http://maltiel-consulting.com/CMP-Chemical-mechanical_planarization_maltiel_semiconductor.pdf